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SPEC NO :
SPECIFICATION
CUSTOMER PRODUCT MODEL NO PREPARED APPROVED SAW FILTER HDF135T SMD-24 CHECKED D A T E 2006-5-11
CUSTOMER RECEIVED:
CHECKED
APPROVED
DATE
Shoulder Electronics Limited
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Page 1 of 6
SAW FILTER
HDF135T
S24
History Record
Date Spec. No. Part No. Customer No. Modify Content Remark
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Page 2 of 6
SAW FILTER
HDF135T
S24
1. SCOPE
This specification shall cover the characteristics of SAW filter F135T
2. ELECTRICAL SPECIFICATION
DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature RF Power Dissipation 2.2Electronic Characteristics
Item Insertion Loss(reference level) Center frequency (3dB) Pass band shape(3 dB-BW) 3 dB bandwidth Relative attenuation Fc-50MHz- fc-15MHz Fc+15MHz - fc+50MHz Temperature coefficient 32 dB 32 dB 85 ppm/K 23.0 MHz Min. Typ. 23.0 135.42 dB MHz Gaussian Max.
10V 10V50Hz/60Hz -40 to +85 -45 to +85 0dBm
This filter can be used in single-end Input/Output or Balanced.
3. DIMENSION
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Page 3 of 6
SAW FILTER
HDF135T
S24
Dimension A B C D E H P
min 13.1 6.3 1.21
0.72
mm typ 13.3 6.5 1.36 1.5 0.8 0.76 2.54
max 13.5 6.7 1.51
0.80
Pin Configuration 11 Input 5 Output Other Ground
4.TEST CIRCUIT
L1=L2=0nH, C1=3.0pF, C2=2.7pF Pin: 11. Input 12. Input (balance) or Ground 1, 2, 3, 4, 7, 8, 9, 10. Ground 5. Output 6. Output (balance) or Ground
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure Subject the device to +85 for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2. 5-2 Low temperature exposure Subject the device to -40 for 16 hours. Then release the device into the room conditions
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Page 4 of 6
SAW FILTER
HDF135T
S24
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2. 5-3 Temperature cycling Subject the device to a low temperature of -40 for 30 minutes. Following by a high temperature of +85 for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in 2.2. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260 10 for 101 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2.2. 5-5 Solderability Subject the device terminals into the solder bath at 245 5 for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2.2. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2.2. 5-7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2.
Typical frequency response
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Tel:0755-82916880
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Page 5 of 6
SAW FILTER
HDF135T
S24
6. REMARK
6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component.
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Tel:0755-82916880
Fax:0755-82916881
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Page 6 of 6

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